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Project Manager for Package Development
2 months ago
As a Project Manager for Package Development at Infineon Technologies, you will be responsible for leading the development of packages for our semiconductor products. This role requires strong project management skills, as well as a deep understanding of packaging technology and semiconductor manufacturing processes.
Key Responsibilities:- Project Execution: Manage the execution of package development projects, ensuring that they are completed on time, within budget, and to the required quality standards.
- Collaboration with Cross-Functional Teams: Work closely with chip/system development, test engineering, and other cross-functional teams to ensure that package development is aligned with overall product development goals.
- Problem Solving and Troubleshooting: Identify and resolve development issues that may impact package quality or delivery.
- Communication and Reporting: Provide regular project updates to stakeholders, including project owners, product line managers, and other relevant teams.
- Sample and Qualification Management: Ensure that samples and qualification builds are completed on time and meet quality requirements.
- Education: Master's or Bachelor's degree in Engineering or Physical Science.
- Experience: At least 5 years of relevant working experience, with 4 years of project management experience.
- Technical Skills: Strong knowledge of semiconductor packaging technology, project management methodologies, and analytical tools.
- Soft Skills: Excellent communication and problem-solving skills, with the ability to work effectively in a team environment.
- Coaching and Mentoring: Opportunities for professional development and growth.
- International Assignments: Opportunities to work on global projects and collaborate with international teams.
- Flexible Working Conditions: A dynamic and flexible work environment that supports work-life balance.