Principal Solution Architect

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions grounded in open standards. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. Discover more at

Principal Solutions Architect – China Region

China

Job Description

Are you passionate about pushing the boundaries of system, interconnect, software, and chip architecture? Do you thrive when pitching cutting-edge technology solutions to customers and industry partners in China? We are seeking a creative customer facing Solution Architect to help facilitate Astera's development of data center connectivity solutions. In this role, you will play a pivotal role in driving the definition of future products by leveraging your expertise in system architecture, SOC architecture, PCIe/CXL/UALink/Ethernet technologies, AI Fabrics and switching, and hardware-software co-design. You will have the opportunity to directly engage with customers (hyperscalers, OEMs and ODMs) to develop innovative solutions to better solve our customers bottlenecks in Chinese hyperscale data centers.

This role is located in China and regular travel throughout the China region is required.  Travel to United States for visits to Astera Labs sites and industry events on an as needed basis.

Basic qualifications 

• BS in Electrical or computer engineering, MS or PhD preferred
• ≥10 years' experience developing high-speed connectivity, fabric, and switching solutions for data centers (PCIe, UALink, Ethernet, CXL, etc.)
• Experience working in a customer-facing role with the ability to articulate technical concepts, influence decision-making, and build business cases
• Ability to dig deeply into technical challenges and use cases with customers
• Strong understanding of chip design principles and architecture
• Strong understanding of AI datacenter system architecture and design challenges
• Strong understanding of "full stack" solutions from silicon to application integration
• Excellent communication and interpersonal skills with the ability to collaborate effectively with internal teams and external partners
• Demonstrated leadership capabilities with a track record of driving technical initiatives and delivering results in a fast-paced environment
• Strong English verbal and written communication skills
• Willingness to travel for customer meetings and industry events

Preferred experience 

• Deep expertise in PCIe, CXL, UALink, and/or Ethernet protocols with a proven track record of designing high-performance interconnect solutions
• Expertise in AI Fabrics (scale-up and scale-out) including switching and networking architectures/solutions
• Experience in product integration with BIOS, kernel, OS, tooling, infrastructure management and BMCs
• Experience with board, system, and rack design with an understanding of environmental constraints and remedies (example cooling and rack-to-rack connectivity)
• Understanding of backplane, copper and optical connectivity solutions
• Experience with benchmarking and performance optimization
• Deep experience in working closely with customers on silicon-based, board and rack/system level solutions

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.