RF Engineer
6 days ago
该职位来源于猎聘 Job Responsibilities
Responsible for 800G/1.6T and above module-level MB or EVB test board, RF channel routing planning, PCB material selection and stack-up definition, pre-simulation, providing PCB RF design report to layout engineer. Responsible for 128Gbaud and above component-level EVB test board, connector selection, PCB material selection and stack-up definition, pre-simulation, providing PCB RF design report to layout engineer. Responsible for all RF simulation items of various projects, 3D EM modeling, RF optimization of each RF interface, passive channel simulation and full channel simulation with chip electrical models, post-simulation confirmation, and providing RF simulation report for cross-department review, some projects may have very tight schedules. Responsible for channel simulation of RF performance comparison for different chips or different parameter configurations in electrical models. Responsible for various EVB/MB/FPC performance confirmations by RF testing. Responsible for locating RF-related problems in each stage of product testing, cause investigations, including RMA. Cooperate with cross-departmental teams at different sites, communicate technical issues, and participate in the evaluation of project plans to ensure smooth completion. RF technical support for various platforms including RF technology communications with PCB/FPC/PKG/connector/chip vendors, RF technology improvement for new products with smaller signal pitch and higher bandwidth, new RF technology learning. Qualifications and requirements Bachelor/Master or above in electronic information engineering, communication engineering, microwave technology or related majors, familiar with signal integrity theory and microwave theory. 1-5 years' experience in high-speed optical-electronics products, experience in 800G/1.6T module MB simulation and optimization is preferred. Familiar with at least one 3D EM field solver tool (HFSS,CST, EMpro, and so on), able to independently complete 3D EM modeling and RF performance optimization. Familiar with at least one channel simulation solver tool (ADS, Circuit, and so on), able to independently connect channel simulation models and generate simulation results of different parameter configurations. Familiar with commonly used PCB materials including Dk/Df parameters and common process parameters of PCB manufacturing, able to independently complete PCB material selections and PCB stack-up definitions for different requirements of various projects, familiar with impedance calculation methods, and provide PCB stack-up and RF trace width and spacing to layout engineers and PCB manufacturers. Familiar with lab instruments such as TDR, PNA, Probe, and so on. Familiar with instrument calibration methods and S-parameter/TDR test data processing / analysis, able to complete RF test independently, experience in RF problem analysis and location is preferred. Able to independently do RF scheme evaluations of various projects, cross-departmental communications of RF, component placement, processing, mechanical, assembly, layout and other related technical issues between different sites, pre-simulation, post-simulation, make review reports and complete reviews. Fluent English in listening, speaking, reading and writing.
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