Engineering Lead | Payment Project | Perm | 60-70k
2 months ago
Hong Kong, 中国
Teki'Spire Limited
全职
HK$60,000 - HK$70,000/月
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• Architect and design end-to-end payment integration solutions with partners, credit card processors, and IAP platforms.
• Collaborate with product managers, other engineering teams, and external partners to define technical requirements and integration strategies.
• Lead technical discussions with regional partners to align on APIs, authentication, and billing flows.
• Oversee implementation and testing of payment modules, ensuring high availability and fault tolerance. Requirements
• Bachelor’s or Master’s degree in Computer Science, Engineering, or related field.
• 5-8 years of experience in solution architecture, with a focus on payment systems integrating with billing platforms, credit card gateways, and IAP platforms
• Strong understanding of RESTful APIs, OAuth, JWT, and secure data transmission.
• Familiarity with backend technologies (Java, Node.js, GoLang etc.) and mobile platforms (Android/iOS)
• Excellent communication skills in English plus Mandarin, and with regional stakeholder management skills.
• Exposure to multi-region deployments and high-availability architectures.