Industralization Engineer

You may not know our name, but you have surely used our innovations and solutions.

Our mission is to unlock the world and make it safer through cutting-edge identity technologies. Every day, around the globe, we are enabling citizens and consumers alike to perform their daily critical activities (such as pay, connect and travel), in the physical as well as digital space. We are transforming their lives by making the world more secure and yet also more streamlined.

We have brought together complementary know-how and technologies that have never been combined before for both the physical and digital era: secured connectivity, secured payments and secured identity management. Cybersecurity, biometrics, large scale distributed systems and Cloud computing, analytics and smart devices are at the core of both our physical products and our software and systems.

We serve our clients in 180 countries thanks to our 15,000 employees worldwide.

Purpose

This role is responsible for the development, implementation and evaluation of production materials, equipment, and technologies before conducting mass production.

Key Missions

•Development & coordination of global & local module activities
•Product qualification of module technology and contact plate development

•Process development of IC module packaging.
•Support operation in D2C improvement projects implementation & governance to achieve anticipated results.
•Development of new test plan and conditions in accordance to industry standard.
•Support internal & external engineering in process parameters development & optimization, process flow development & implementation

Key Deliverables:

•Ensure product qualification requirement in accordance to test program defined in Idemia.
•Failure analysis execution of product introduction non-conformity.
•Support in problem solving of quality issues & customer complain
•Weekly review of key project roadmap, scorecard. Planning and follow up of action items
•New chips introduction technical assessment and qualification proceedings. Organize test plans according to product lines, MO, FI, PSI.
•Manage qualification flow RFPP, RFPI, FRVM proceedings and reporting.
•New bommaterials qualification & process change management &ERP integration.
•Manage product release documents, database. 
•Write new product specification, review and update of specs documents.

Requirements:
•Experienced in microelectronic assembly engineering
•Able to extract/identify failure mechanism in complex IC functional failure.

•Bachelor degree, major in electronics / electriacl or equivalent engineering field. 
•>5 years experience in manufacturing environment of IC packaging. (could be wafer fab company but not essential)

•Good communication
-Ability to provide precise executive reporting
-Fluent oral & written English

•Methodical
-Proficient with Office 365 suite including deep knowledge of Excel 
-Proficient with AutoCAD for 2D & 3D modeling 

•Rigorous
-Responsive to constructive criticism and eager to challenge the status quo.
-Attentive to details-Excellent project management and execution skills

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