Shock/Vibration and Package Design Engineer
5 months ago
Description and Requirements
Lenovo is seeking a Global Packaging Engineer. This engineer will be Full-time responsible for developing and implementing world class packaging solutions and manufacturing and quality processes for our CSP portfolio of Job Functions products, options and service parts. This is a full-time position and reports to Shock/Vibration and Packaging Engineering Manager and is based at Lenovo Group Headquarter in Beijing, PRC.
Responsibilities include:
Develop packaging solutions for Lenovo CSP products Troubleshoot new and existing packaging problems involving designs, materials, and processes and provide creative, timely, and cost-effective solutions Plan and execute reliability testing via structure equipment (Vibration Table, Package Drop Machine, spectrum analyzer and relative equipment, etc…). Work with global MFG locations to facilitate packaging introductions and process improvements Work with global suppliers to introduce new designs, materials, and maintain supplier packaging quality. Identify and implement cost savings initiatives related to packaging materials, transportation, and process efficiency. Create and maintain structure and packaging relative Spec/SOP/WI. Work with customers closely to understand customer’s requirements and concerns, provide solid solutions.Position Requirements:
Degree in packaging Science, or related engineering field 8+ years packaging design and test experience Familiar with reliability validation testing and the industry spec in the packaging /mechanical structure field. Great communication skills both verbal and written, English proficiency Team player with good interpersonal skills Self-motivated and driven to perform Ability to work independently in a lab environment Ability to work cross-functionally across many levels of a matrix organization under pressure Additional Locations : * China - Beijing - 北京(Beijing) * China * China - Beijing * China - Beijing - 北京(Beijing)-
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