Engineering leadership program-Embedded Software Engineer

3 weeks ago


Hangzhou, China Carrier Full time

Country:

China

Location:

LOC009: No. 181, Weiken Street, Baiyang Street, Qiantang District, Hangzhou

Position Title

Engineering leadership program-Embedded Software Engineer

About Carrier

Carrier Global Corporation, global leader in intelligent climate and energy solutions is committed to creating solutions that matter for people and our planet for generations to come. From the beginning, we've led in inventing new technologies and entirely new industries. Today, we continue to lead because we have a world-class, diverse workforce that puts the customer at the center of everything we do.

About this Role

Carrier is looking for software, electrical, mechanical, systems, and other engineering majors with demonstrated leadership ability and strong academic performance to join our competitive Carrier Engineering Leadership Program (ELP) . The ELP offers new graduates an opportunity to deliver impactful contributions to strategic projects through three eight-month rotations across various Carrier business units.

ELP rotation locations will be in China Shanghai or Hangzhou or Foshan.

Candidates selected for the program will receive front-line, hands-on, meaningful assignments designed to stretch their capabilities and accelerate their professional development. In addition to the hands-on experience, the program includes high-caliber training, mentorship, and guidance from our diverse team of Carrier executives and program alumni to build a strong and lasting global network of colleagues.

Our Disruptive Climate Solutions and Integrated Energy Systems team is evolving to maintain Carrier’s leadership in the market through investments in advanced research, technologies and methods that will shape the future of our products and services. As part of this transformation, we are hiring and empowering a recently graduated electrical engineer to help us innovate and pursue sustainable solutions for our customers.

角色 目的:

  • Co-work with other colleges to development Air-condition products. for example, Indoor units, Outdoor units, Remote controller, IOT products and so on...

  • Understand the chip features to propose, collect and achieve the requirements with system architecture and other cross-functional teams, such as, PM and E&E and performance team..

Key Responsibilities

  • Research, development, electrical design and validation of technology alternatives to the current status quo in HVAC&R systems

  • Development, electrical design and validation of air conditioning systems to include innovative independent carbon capture and dehumidification sub-systems

  • Analysis of energy efficiency and reliability performance, while meeting initial and operational cost targets

  • Ownership of the electrical, controls and DAQ elements of benchtop set-ups designed to validate performance of advanced technologies experimentally

  • Ownership of identification, creation and growth of disruptive projects pipelines, aligned with themes in disruptive HVAC&R, sustainability and service. This responsibility will include working with global team members, other functions within Carrier, and external partners and universities

  • In addition, you will have exposure to formal and on-the-job training in areas related to engineering, communications, and management

角色职责:

  • Design, implement and verify the firmware functional modules or drivers based on the requirements and chip features of air condition product.

  • Write technical design specification document.

  • To design other ODM product and verify the functions that offered from Third-party vender.

Required Qualifications

  • Bachelor's degree above in Engineering or related field

  • Strong academic performance, minimum cumulative GPA of 3.0, with 3.2 preferred students

  • Must be geographically mobile and have the ability to relocate for rotations.

  • To be eligible for the program, you must be a 2023-2025 graduate of the degree in the relevant field and start in the Leadership Program July 2025

Preferred Qualifications

  • Proactive and results-driven; thrives in a fast-paced and dynamic environment

  • Excellent analytical and problem-solving skills

  • Strong ability to communicate effectively and collaborate with cross-functional teams

  • Demonstrated technical understanding and skills.

  • Excellent communication, inter-discipline skills

  • Knowledge of HVAC&R systems and cycle analysis

  • Knowledge of carbon capture technologies and materials

  • Knowledge of dehumidification technologies and materials

  • Knowledge of electrical/power control systems

  • Knowledge of thermodynamic cycles, thermal systems and heat transfer

  • Knowledge of analytical and high-fidelity model development, model-based predictions and experimental validation

  • Knowledge of statistics, reliability and economic analysis

  • Knowledge of system engineering methodologies, design of experiments

最低要求:

  • Bachelor's degree in Computer Engineering, auto control or related fields. or other major student who have strong interesting in Embedded firmware design.

  • Experienced with all phases of embedded FW development in platform environment with C language.

  • Debug skills with tools such as Renesas E1/E2 simulator tools, serial debugger, protocol analyzer and oscilloscopes.

  • Can Communication in English frequently by e-mail.

Carrier is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.


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