Electronics Hardware Design Lead

1 day ago

Shanghai, Shanghai, China Wabtec Full time
Advanced Electronics Packaging Engineer

About Us:

Wabtec Corporation is a global leader in providing innovative solutions for freight and transit rail. With a rich history spanning nearly four centuries, our company has developed unparalleled expertise in digital technologies, manufacturing, and services. Our mission is to create transportation solutions that drive progress and improve the world.

Job Overview:

We are seeking an experienced Electronics Hardware Design Lead to join our team. As a key member of our Electronics Hardware group, you will be responsible for designing mechanical packaging for electronic control and power supply assemblies. This role requires strong technical skills, including proficiency in 3D CAD software, simulation tools, and electrical connectors.

Responsibilities:

  • Design and develop complex electronic assemblies involving PCBs and interconnects with mechanical enclosures and parts.
  • Optimize panel architecture to meet project goals for performance, testability, manufacturability, and cost.
  • Research and select connector and interconnect devices based on project requirements and vendor options.
  • Apply industry best practices for ruggedized electronics, including thermal management, EMC, shock, and vibration.
  • Create finite element models to simulate load cases and predict structural, fatigue, and dynamic characteristics of new products.
  • Perform detailed thermal simulation of electronic assemblies to predict operating temperatures under various conditions.
  • Analyze detailed mechanical assembly characteristics, such as bolted joints, tolerance stack-ups, and GD&T.
  • Prepare and release design documentation, including drawings, calculations, bills of material, and purchase specifications.
  • Conduct technical design reviews with internal and external customers.
  • Support the organization with vendor selection, production launch, and PPAP documentation.
  • Lead and execute the validation and qualification of new products, components, and assemblies, focusing on mechanical and thermal performance, and electrical functional tests.

Requirements:

  • Bachelor of Science in Mechanical Engineering or related engineering field.
  • 10+ years of experience designing mechanical packaging for electronic control and power supply assemblies.
  • Proficient in 3D CAD software (preferably Siemens NX CAD/Unigraphics).
  • Proficient in simulation tools for stress and thermal analyses (e.g., ANSYS, Icepak, CFD).
  • Experience with integrating rigid, flexible, and rigi-flex printed circuit boards into mechanical assemblies.
  • Familiarity with electrical connectors and interconnect methodologies.
  • Ability to travel 10% of the time.

Benefits:

  • $120,000 - $150,000 per year salary range.
  • Opportunities for professional growth and development.
  • Diverse and inclusive work environment.
  • Competitive benefits package.

About Wabtec Corporation:

We are committed to taking on the world's toughest challenges through a culture of leadership, diversity, and inclusiveness. We believe in hiring talented individuals from diverse backgrounds to foster creativity and innovation. At Wabtec Corporation, we are dedicated to creating a limitless source of ideas and opportunities.

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