Senior Principal Engineer SiC Packaging

Found in: Talent CN S2 - 1 week ago


Shanghai, China Nexperia Full time

This is you

Work in an engaged multi-cultural team with global footprint, co-operate with internal and external development and production partners Having as Package Architect the leading responsibility for functionality and performance of SiC Diodes Packages and "Bare Die" first-level interconnect technologies Interfacing to global package and assembly development community Collect technical customer needs, market trends and benchmarking information concerning SiC packages. Propose own innovative solutions Support all Business Group functions with SiC power package expertise Pro-active Package Requirements Management and road-mapping derived from product roadmaps and market trends

What you will need

University degree in Semiconductor Packaging, Physics, Materials Technology, Electronics Engineering or similar Extensive knowledge of semiconductor packages, assembly materials and assembly processes 5 years of experience in power package development, including experience in Clip-bonding technologies 3 years of experience in SiC or GaN packaging and "Bare Die" processing. Very good understanding of related technologies Strong skills in architectural thinking, critical judgement and fast and structured problem solving Energetic and result driven, technical Leader with ambition to grow Excellent communication skills and team player within global, intercultural environment Fluent Business English

This is your department and colleagues

From our Shanghai office you will work with an engaged multi-cultural team with a global footprint.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

Nexperia is an Equal Opportunity/Affirmative Action Employer.


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