Senior Process Development Engineer
2 weeks ago
About the role
The Senior Process Development Engineer is responsible for Power Module process development to meet Business Group R&D roadmap. Scope: standard & customized power module including potted and molded types, focusing on Transfer Molding/Deflashing/Post-plating process development.What you will do:
To work closely with different internal & external function team (Marketing/Application/ Design/Simulation/PJM/Operation) to support new package/new technologies projects and provide professional technical inputs. To develop new process technologies and enablers which will support company’s new products/new package roadmap. To timely support sample building oriented by product or development purpose with relevant equipment operation ability. To support all Business Group functions with SiC/GaN/IGBT power module package expertise. To support die validation and qualification for external die source selection or self-innovated die development. To innovate and output IP submissionWhat you will need:
Bachelor or master’s degree in Semiconductor Packaging, Physics, Materials Technology, Electronics Engineering or equivalent. At least 5 years of working experience in semiconductor domain and 3 years of power package (with SiC/GaN/IGBT) development experience. Familiar with the packaging technologies applied on mainstream power module such as TPAK/T2PAK/SSC/DSC/HPD/PIM. Proficient with advanced power module interconnection technology like Film Assisted Molding/Laser Deflashing/Post-plating/Sputtering etc. Good communication and problem-solving skills for efficient teamwork. Good emotion management and self-discipline. Result oriented and willing to explore new fields. Fluent oral and written business English.Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
Nexperia is an Equal Opportunity/Affirmative Action Employer.
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