Senior Staff Engineer Package Development Expert

6 days ago


Chengdu, Sichuan, China Infineon Technologies Full time
Job Title: Senior Staff Engineer Package Development

At Infineon Technologies, we are seeking a highly skilled Senior Staff Engineer Package Development to join our team. As a key member of our organization, you will play a critical role in driving the development of innovative package solutions that meet the needs of our customers.

Key Responsibilities:
  • Provide technical support for new product introduction at subcons, ensuring that technical, quality, schedule, and cost requirements are achieved.
  • Responsible for technical support of new product/package/new process development.
  • Ensure that the project meets customer requirements in terms of timeline, cost, and quality.
  • Assess and mitigate technical risks.
  • Provide design proposals for package, lead frame, substrate, and Cu-clip of new products.
  • Closely interact with the project manager, subcon interface, chip designer, application team, marketing, and business units for new product design and project roadmaps.
  • Provide technical direction related to problem-solving of process and reliability issues.
  • Closure of Package Development related deliverables and documents.
  • Technical documentation through Delta analysis, DFMEA, Process Flow & Control plan.
Requirements:
  • Master/Bachelor Degree in Engineering and Physical Science.
  • Minimum requirement 5 years of Package/Process development in Semiconductor packaging.
  • Experience in semiconductor package development.
  • Analytical and self-driven.
  • Experience in analytical tools: Delta Analysis, DFMEA, DoE, 8D, and simulation.
  • Proficient in AutoCAD for 2D drawing. Knowledge using 3D software (e.g. AutoCAD 3D, Inventor, and SolidWorks) is an advantage.
  • Exposure to the development of a wide variety of packages: TO, QFN, Cu Clip, Flip Chip, SOIC, QFP.
  • Knowledge in package design rules.
  • Proficient in industry standards for package reliability test and qualifications.
  • Knowledge of FA techniques.
  • Knowledgeable on assembly processes.
  • Can interpret package simulation results. Knowledge in package simulation software (e.g. ANSYS, SolidWorks) for FEA & thermal analysis is an advantage.
  • Excellent in statistical analysis that can provide a clear direction based on package/process DOE.
  • Working knowledge of DFMEA during design phase and ability to create strategy to mitigate risk.
  • Knowledge in IP management and patent filing.
What We Offer:
  • Coaching, mentoring, and networking possibilities.
  • Wide range of training offers & planning of career development.
  • International assignments.
  • Different career paths: Project Management, Technical Ladder, Management & Individual Contributor.
  • Flexible working conditions.
  • Medical coverage.
  • On-site social counselling and works doctor, in Wuxi only.
  • Provision of health tips, health knowledge sharing, annual medical check.
  • Employees in Shanghai are entitled to use a gym located close to the office for free.
  • On-site canteen, in Wuxi only.
  • Private insurance offers in some sites.
  • Wage payment in case of sick leave.
  • Corporate pension benefits in some sites.

We are committed to creating a diverse and inclusive work environment where everyone feels valued and empowered to reach their full potential. If you are passionate about innovation and customer success, and you have the skills and experience we are looking for, we encourage you to apply for this exciting opportunity.



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