Senior Semiconductor Packaging Lead

1 week ago


Shanghai, Shanghai, China Renesas Electronics Full time
Job Overview

We are seeking an exceptional Senior Semiconductor Packaging Engineer to join our team at Renesas Electronics. As a key member of our packaging team, you will be responsible for developing and resolving complex packaging issues for high-performance power semiconductor products.

Key Responsibilities
  • Packaging Design and Development: Collaborate with cross-functional teams to design and develop advanced packaging solutions for high-power discrete, multi-chip, stacked, and module packages.
  • Process Development and Optimization: Analyze stress, thermal capability, and electrical performance of packaging solutions, with a deep understanding of thermal-mechanical and electro-chemical interactions.
  • Qualification and Reliability: Define BOM, assembly process development, assembly specification, and qualification per standard requirements to ensure high reliability and robustness.
  • Problem-Solving and Collaboration: Resolve package reliability and assembly issues through thorough knowledge of the whole assembly processes, collaborating with device design/product engineering teams and external high-volume packaging vendors.
Qualifications
  • Education: Bachelor's degree in Electrical Engineering, Mechanical Engineering, or Materials Science.
  • Experience: Minimum 10 years of experience in semiconductor packaging technology, with hands-on design for manufacturability.
  • Skills: Strong knowledge of ACAD software, package-related design/simulation software (thermo-mechanical, thermal, and electrical), and excellent problem-solving skills.


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